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Sökning efter: IEEE International Conference on Micro Electro Mechanical Systems 58 träffar

Titel Författare År Språk
41 Large-scale Integration of 2D Material Heterostructures by Adhesive Bonding CANADA,18-22 Jan. 2020 Vancouver 33rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2020) Arne Quellmalz 2020 Engelska
42 A low-temperature thermopneumatic gas bubble valve 2006 22-26 Jan TURKEY Istanbul 19th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2006) Wouter van der Wijngaart 2006 Engelska
43 LARGE SCALE INTEGRATED 3D MICROFLUIDIC NETWORKS THROUGH HIGH YIELD FABRICATION OF VERTICAL VIAS IN PDMS 2010 24-28 Jan China Hong Kong 23rd IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2010),Wanchai Carl Fredrik Carlborg 2010 Engelska
44 Design optimization and characterization of nanogap crack-junctions 22-26 January 2017 USA Las Vegas 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) Valentin Dubois 2017 Engelska
45 Maskless Manufacturing of Through Glass Vias (TGVs) and Their Test Structures 22-26 January 2017 USA Las Vegas 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS) Miku Laakso 2017 Engelska
46 CAPILLARY PUMPING WITH A CONSTANT FLOW RATE INDEPENDENT OF THE LIQUID SAMPLE VISCOSITY AND SURFACE ENERGY USA Las Vegas 2017 January 22-26 The 30th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2017) Weijin Guo 2017 Engelska
47 High-speed Metal-filling of Through-Silicon Vias (TSVs) by Parallelized Magnetic Assembly of Micro-Wires 24 January 2016 through 28 January 2016 China Shanghai MEMS 2016 29th IEEE International Conference on Micro Electro Mechanical Systems Simon J. Bleiker 2016 Engelska
48 Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling 2010 JAN 24-28 PEOPLES R CHINA 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Hong Kong Andreas C. Fischer 2010 Engelska
49 Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems Fredrik Forsberg 2013 Engelska
50 Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems Hithesh K. Gatty 2013 Engelska
51 Amorphous carbon active contact layer for reliable nanoelectromechanical switches CA San Francisco 26 January 2014 - 30 January 2014 MEMS 2014 27th IEEE International Conference on Micro Electro Mechanical Systems Daniel Grogg 2014 Engelska
52 Wide temperature range through silicon vias made of Invar and spin-on glass for interposers and MEMS 24 January 2016 through 28 January 2016 China Shanghai MEMS 2016 29th IEEE International Conference on Micro Electro Mechanical Systems Miku Laakso 2016 Engelska
53 Low gas permeable and non-absorbent rubbery OSTE+ for pneumatic microvalves USA CA 2014,San Fransisco January 26-30 The 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014) 2014 Engelska
54 Analysis of linearity degradation in multi-stage RF MEMS circuits MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems Umer Shah 2013 Engelska
55 Ultrarapid synthesis of microbeads with tuneable surface probe density 24 January 2016 through 28 January 2016 China Shanghai MEMS 2016 29th IEEE International Conference on Micro Electro Mechanical Systems Xiamo Zhou 2016 Engelska
56 Formation of a thin-walled Spider Silk Tube on a Micromachined Scaffold 21 January 2018 through 25 January 2018 United Kingdom Belfast MEMS 2018 31st IEEE International Conference on Micro Electro Mechanical Systems Weijin Guo 2018 Engelska
57 Droplet microfluidics inside paper 21 January 2018 through 25 January 2018 United Kingdom Belfast MEMS 2018 31st IEEE International Conference on Micro Electro Mechanical Systems H. Yasuga 2018 Engelska
58 Biaxial strain in suspended graphene membranes for piezoresistive sensing CA; United States; 26 January 2014 through 30 January 2014 MEMS 2014; San Francisco 27th IEEE International Conference on Micro Electro Mechanical Systems Anderson D. Smith 2014 Engelska

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