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Sökning efter: Andreas C. Fischer 17 träffar

Titel Författare År Språk
1-2 Integration and fabrication techniques for 3D micro- and nanodevices (flera utgåvor) Andreas C. Fischer 2013 Engelska
3 Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS) Andreas C. Fischer 2011 Engelska
4 Graphene-based piezoresistive pressure sensing for uniaxial and biaxial strains 8 June 2014 through 9 June 2014 SNW 2014 Silicon Nanoelectronics Workshop Anderson David Smith 2014 Engelska
5 Biaxial strain in suspended graphene membranes for piezoresistive sensing CA; United States; 26 January 2014 through 30 January 2014 MEMS 2014; San Francisco 27th IEEE International Conference on Micro Electro Mechanical Systems Anderson D. Smith 2014 Engelska
6 Very high aspect ratio through silicon vias (TSVs) using wire bonding TRANSDUCERS and EUROSENSORS 2013; Barcelona; Spain; 16 June 2013 through 20 June 2013 Actuators and Microsystems 2013 17th International Conference on Solid-State Sensors Stephan Schröder 2013 Engelska
7 High-speed Metal-filling of Through-Silicon Vias (TSVs) by Parallelized Magnetic Assembly of Micro-Wires 24 January 2016 through 28 January 2016 China Shanghai MEMS 2016 29th IEEE International Conference on Micro Electro Mechanical Systems Simon J. Bleiker 2016 Engelska
8 Stress-minimized packaging of inertial sensors using wire bonding TRANSDUCERS and EUROSENSORS 2013; Barcelona; Spain; 16 June 2013 through 20 June 2013 Actuators and Microsystems 2013 17th International Conference on Solid-State Sensors Stephan Schröder 2013 Engelska
9 Heterogeneous 3D integration of MOEMS and ICs 31 July 2016 through 4 August 2016 OMN 2016 21st International Conference on Optical MEMS and Nanophotonics Frank Niklaus 2016 Engelska
10 Through-Glass Vias for MEMS Packaging 13-15 May Finland Helsinki 2018 The Micronano System Workshop (MSW) Miku Laakso 2018 Engelska
11 high aspect ratio tsvs fabricated by magnetic self-assembly of gold-coated nickel wires CA San Diego 2012 May 29 - June 1 62nd Electronic Components and Technology Conference (ECTC) Andreas C. Fischer 2012 Engelska
12 Layer-by-layer 3D printing of Si micro- and nanostructures by Si deposition, ion implantation and selective Si etching United Kingdom Birmingham 2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO),The International Conference Centre Birmingham,20-23 August 20112 Andreas C. Fischer 2012 Engelska
13 Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays USA. 25 - 29 April 2011 Florida and Sensing 2011. Orlando Security SPIE Defense Per Ericsson 2011 Engelska
14 Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires Andreas C. Fischer 2011 Engelska
15 Heterogeneous Integration for Optical MEMS 2010 NOV 07-11 CO Denver 23rd Annual Meeting of the IEEE Photonics-Society Andreas C. Fischer 2010 Engelska
16 Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling 2010 JAN 24-28 PEOPLES R CHINA 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Hong Kong Andreas C. Fischer 2010 Engelska
17 Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Andreas C. Fischer 2010 Engelska

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