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Sökning efter: Niclas Roxhed 30 träffar

Titel Författare År Språk
1 Hermetic integration of liquids in MEMS by room temperature, high-speed plugging of liquid-filled cavities at wafer level International Conference on Micro Electro Mechanical Systems (MEMS) Mikael Antelius 2011 Engelska
2 Room-temperature wafer-level vacuum sealing by compression of high-speed wire bonded gold bumps Mikael Antelius 2011 Engelska
3 Toward 17µm pitch heterogeneously integrated Si/SiGe quantum well bolometer focal plane arrays USA. 25 - 29 April 2011 Florida and Sensing 2011. Orlando Security SPIE Defense Per Ericsson 2011 Engelska
4 Fabrication of high aspect ratio through silicon vias (TSVs) by magnetic assembly of nickel wires Andreas C. Fischer 2011 Engelska
5 Heterogeneous Integration for Optical MEMS 2010 NOV 07-11 CO Denver 23rd Annual Meeting of the IEEE Photonics-Society Andreas C. Fischer 2010 Engelska
6 high aspect ratio tsvs fabricated by magnetic self-assembly of gold-coated nickel wires CA San Diego 2012 May 29 - June 1 62nd Electronic Components and Technology Conference (ECTC) Andreas C. Fischer 2012 Engelska
7 Low-Cost Through Silicon Vias (Tsvs) With Wire-Bonded Metal Cores And Low Capacitive Substrate-Coupling 2010 JAN 24-28 PEOPLES R CHINA 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Hong Kong Andreas C. Fischer 2010 Engelska
8 Selective electroless nickel plating on oxygen-plasma-activated gold seed-layers for the fabrication of low contact resistance vias and microstructures 23rd IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2010) Andreas C. Fischer 2010 Engelska
9 Integration of distributed Ge islands onto Si wafers by adhesive wafer bonding and low-temperature Ge exfoliation PORTUGAL Estoril 2015 JAN 18-22 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) Fredrik Forsberg 2015 Engelska
10 Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems Fredrik Forsberg 2013 Engelska
11 Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration MEMS 2013; Taipei; Taiwan; 20 January 2013 through 24 January 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems Hithesh K. Gatty 2013 Engelska
12 Capillary-Driven Microfluidic Devices for Sample Preparation of Bio-Medical Specimens Janosch Hauser 2022 Engelska
13 3D Printed Mems 19-23 January 2025 Taiwan Kaohsiung 2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS) Po-Han Huang 2025 Engelska
14 Advancing portable, aqueous drug delivery to the human lung Torben Last 2022 Engelska
15 A Disposable Chip Enabling Metering In Dried Blood Spot Sampling Micro TAS 2013 Gabriel Lenk 2013 Engelska
16 A Disposable Chip for the Collection of Quantitative Dried Blood Spot Samples Sweden Uppsala MSW 2014,15-16 May Gabriel Lenk 2014 Engelska
17 Capillary driven devices for patient-centric diagnostics Gabriel Lenk 2018 Engelska
18 Disposable Chip to Enable Metering in Dried Blood Spot Sampling Medicinteknikdagarna Gabriel Lenk 2013 Engelska
19 Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers California 2012 San Francisco Symposium L,April 9-13 2012 MRS Spring Meeting & Exhibit Gunnar B. Malm 2012 Engelska
20 A LIQUID-TRIGGERED LIQUID MICROVALVE 2003 08-12 Jun USA MA BOSTON Actuators and Microsystems (IEEE TRANSDUCERS 2003) 12th IEEE International Conference on Solid-State Sensors Jessica Melin 2003 Engelska

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